Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
Year: 2024
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4066833
Authors: Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Army Research Laboratory
Award: G7477123231
OpenAlex ID: W4403393953