Work

Innovative System-in-Package Building Blocks for Future Space Applications

Year: 2024

Type: conference-paper

Source: Electronics System-Integration Technology Conference (ESTC)

Authors: Helene Jochem, Hugo Garcia, Norbert Venet, Mirko Rocci, Luca Sollecchia, Poul Juul, Monique Mayr, Paolo Scalmati, Giovanni Cucinella

Institutions: Thales Alenia Space (France), Panasonic (Japan), IMT Srl (Italy)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403421298

FWCI:

Cites: 7

Cited by:

Related to: 10