Year: 2024
Type: article
Abstract: In wafer fabrication, the contamination of halogen is commonly encountered, such as fluorine, chlorine, bromine. These contaminants can seriously impact product’s quality and yield. In the previous works, we have studied F and Cl-induced metal corrosion and failure mechanisms. In this paper, we will apply TEM analysis technique to study Br-indued corrosion and failure mechanism. Moreover, we will introduce a model of “Br-chain chemical reaction” to explain why even a little bit of Br contamination, it can cause very bad corrosion results, and the formation of the worm-like defects at the side of Al metal lines in wafer fabrication.
Author: Younan Hua
Language: English
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4403434168