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Array Packaging with Integrated Mirrors for High Power Multi-Chip UVC-LED Modules

Year: 2024

Type: conference-paper

Source: Electronics System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc60143.2024.10712044

Authors: Ulli Hansen, Xiaodong Hu, Simon Maus, Oliver Gyenge

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403442442

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