Work

Analytical Study on the Warpage Deformation of Die Attach Structure in Power Devices

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3481464

Authors: Xinghe Luan, Liguo Ding, Xuemin Li, Hongjie Zhang, Kewei Li, Longzao Zhou, Fengshun Wu

Institutions: State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G330560727

OpenAlex ID: W4403447987

FWCI: 0.413

Cites: 33

Cited by: 4

Related to: 10