A chiplet-based gesture recognition system with modular architecture
Year: 2024
Type: conference-paper
DOI: 10.1117/12.3034006
Authors: Yafei Liu, Xian Tang, Zheng Yang, Xiangyu Li
Institution: Tsinghua University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4403467902
