Work

CLEAR Cross-Layer Resilience: A Retrospective

Year: 2024

Type: article

Source: IEEE Design and Test

DOI: 10.1109/mdat.2024.3483028

Authors: Eric Cheng, Hyungmin Cho, Shahrzad Mirkhani, Lukasz Szafaryn, Jacob Abraham, Pradip Bose, Chen-Yong Cher, Klas Lilja, Kevin Skadron, Mircea Stan, Subhasish Mitra

Institutions: Stanford University, Sungkyunkwan University, Meta (United States), Intel (United States), The University of Texas at Austin, IBM (United States), Robust Chip (United States), University of Virginia

Language: English

Topic: Radiation Effects in Electronics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403510973

FWCI: 0.411

Cites: 15

Cited by: 4

Related to: 10