Work

Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3482467

Author: Eyal Weiss

Language: English

Topic: Physical Unclonable Functions (PUFs) and Hardware Security

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403511142

FWCI: 2.886

Cites: 25

Cited by: 9

Related to: 10