Work

Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition

Year: 2024

Type: conference-paper

Abstract: International audience

Source: HAL (Le Centre pour la Communication Scientifique Directe)

Authors: Janod, G, Chachay, L, Schoenleber, J, Avenas, Y, Bouvard, D, Daudin, R, Missiaen, J, M, Gigandet, M, P, Hihn, J, Y, Khazaka, R

Institutions: Institut polytechnique de Grenoble, Centre National de la Recherche Scientifique, Science et Ingénierie des Matériaux et Procédés, Laboratoire de Génie Électrique de Grenoble, Université Grenoble Alpes, Université Bourgogne Franche-Comté, Institut UTINAM, Safran (France)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

Funder: Agence Nationale de la Recherche

Awards: G3010527862, COPPER based PACKaging for direct cooled power module

OpenAlex ID: W4403522750

FWCI:

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