Work

Study of Mutual Crosstalk Between Hemispheres in Roughness Hemispherical Model

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3483194

Authors: Zhen Fang, Jihua Zhang, Jinxu Liu, Shuqi Li, Libin Gao, Hongwei Chen, Xingzhou Cai, Wanli Zhang

Institutions: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Films and Integrated Devices

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Yunnan Key Research and Development Program

Award: G5809841437

OpenAlex ID: W4403534317

FWCI:

Cites: 13

Cited by:

Related to: 10