Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding
Year: 2024
Type: article
Authors: Li-Hsin Huang, Yu-Ying Cheng, Tzong-Lin Wu
Institution: National Taiwan University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G4664526173, G811559933
OpenAlex ID: W4403534322