Work

Reasons for Defects in Solder Paste Reflow in a Vapor Phase Soldering System

Year: 2024

Type: conference-paper

Source: International Conference on Actual Problems of Electron Devices Engineering

DOI: 10.1109/apede59883.2024.10715946

Authors: Yury Tikhonov, Alexander Petushkov, Ilya Stavitsky, Stanislav Averin, Mikhail Ternovsky, Oleg Kudryavtsev

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403535351

FWCI:

Cites: 5

Cited by:

Related to: 10