Work

Study on Oxygen Plasma-Based Copper Etching Process

Year: 2024

Type: article

Source: ECS Journal of Solid State Science and Technology

DOI: 10.1149/2162-8777/ad89f7

Authors: Jia Quan Su, Yue Kuo

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403628693

FWCI: 0.077

Cites: 76

Cited by: 1

Related to: 10