Work

Study of Residual Stress on the Copper Plate Using Laser Ultrasound Technique

Year: 2024

Type: conference-paper

Source: International Conference on Applying New Technology in Green Buildings (ATiGB)

DOI: 10.1109/atigb63471.2024.10717844

Authors: Che Hua-Yang, Le Van - Nguyen, He Thong-Bui

Institutions: National Taipei University of Technology, University of Da Nang, Trường Đại học Sư phạm Kỹ thuật

Language: English

Topic: Ultrasonics and Acoustic Wave Propagation

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403635948

FWCI:

Cites: 13

Cited by:

Related to: 10