Work

Probing the Scaling Effect on Electromigration and Segregation in Sn–58Bi Solder Interconnects Through Numerical Modeling

Year: 2024

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2024.3478188

Authors: Shuibao Liang, Xin-Ping Zhang, Han Jiang, Zhihong Zhong

Institutions: Hefei University of Technology, South China University of Technology, Loughborough University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Foundation for Research, Science and Technology, National Natural Science Foundation of China, Natural Science Foundation of Anhui Province

Awards: G260487558, G555801954, G6053960963, G7129027855, G8715052602

OpenAlex ID: W4403636229

FWCI: 0.616

Cites: 33

Cited by: 6

Related to: 10