Work

Engineering the Atomic Interface of Refractory‐Metal‐Reinforced Copper Matrix Using Direct Ink 3D Printing

Year: 2024

Type: article

Source: Advanced Engineering Materials

DOI: 10.1002/adem.202401747

Authors: Rakesh Das, Raphael Benjamim de Oliveira, Banty Kumar, Vidhyadhar Mishra, Suman Sarkar, Suman Sarkar, Isaac de Macêdo Felix, Leonardo Dantas Machado, Chandra Sekhar Tiwary

Institutions: Indian Institute of Technology Kharagpur, Universidade Federal do Rio Grande do Norte, Indian Institute of Technology Jammu, Universidade Federal de Pernambuco

Language: English

Topic: Additive Manufacturing Materials and Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403636599

FWCI: 0.542

Cites: 64

Cited by: 4

Related to: 10