Work

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Year: 2024

Type: conference-paper

DOI: 10.1109/esserc62670.2024.10719443

Authors: Nitish Kumar, Yukai Chen, Venkateswarlu Sankatali, Subrat Mishra, Ankur Gupta, Pushpapraj Singh, Francky Catthoor, James Myers, Julien Ryckaert, Dwaipayan Biswas

Institutions: IMEC, Indian Institute of Technology Delhi

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4403677057

FWCI: 4.03

Cites: 12

Cited by: 5

Related to: 10