Work

Flip Chip and Backside Techniques (2024 Update)

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024tpr1

Authors: Edward I. Cole, Kira L. Fishgrab, Daniel L. Barton, Karoline Bernhard-Höfer

Institutions: Sandia National Laboratories, Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403684956

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