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Advanced Package Sample Preparation Leveraging Precision CNC-Based Milling and Selective Microwave Induced Plasma Etching

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0492

Authors: Joseph Sanchez, Chuan Zhang, John Aguada, Jane Li, Jiaqi Tang, Chris Richardson

Institution: Nvidia (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685109

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