Work

Inexpensive and Efficient Backside Decapsulation Technique for Challenging Down Bond Devices

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0515

Authors: Chaoliang Cheng, Jing Zhou

Institution: Texas Instruments (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685366

FWCI:

Cites:

Cited by:

Related to: 10