Work

Application of Thermal Emission Phase Lock-In Image Statistics to Locate Defects in Z-depth for Advance 2.5D Packaging

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0213

Authors: Daniel Nuez, Phoumra Tan, Brian Lai

Institutions: Advanced Micro Devices (United States), Thermo Fisher Scientific (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403685371

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