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Novel Backside IC Preparation Stopping on STI with Full Circuit Functionality Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0416

Authors: Norbert Herfurth, Awwal A. Adesunkanmi, Abdelkhalek Bouchtouq, Gerfried Zwicker, Christian Boit

Institutions: Leibniz Institute for High Performance Microelectronics, Technische Universität Berlin

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685510

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