Work

IC Backside Deprocessing Physical Failure Analysis with Laser Ablation Technique

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0406

Authors: P.K. Tan, S.L. Ting, Angela Teo, N.Y. Xu, Alfred Quah, Y.S. Tam, K.K. Kang, Jessica Oh, A.F. Roslan, Nivasini Thiruppathi, G. Wicaksono, H.H.W. Thoungh, T.T. Yu, P.T. Ng, C.Q. Chen

Institution: GlobalFoundries (Singapore)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685561

FWCI:

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