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A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0312

Authors: Yu-Jen Chang, Cheng-Hsin Liu, Yi-Sheng Lin, Chen-Chao Wang, Nicky Liu, Bessy Chiu, Allen Gu

Institutions: Advanced Semiconductor Engineering (Taiwan), Carl Zeiss (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403685624

FWCI: 1.562

Cites:

Cited by: 2

Related to: 10