Work

Increasing TEM Prep Throughput with an Extendable Manipulator Tip

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0153

Authors: Valerie Brogden, Jeff Garman, Kurt Langworthy, Steve Wiemholt

Institution: University of Oregon

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403685730

FWCI:

Cites:

Cited by:

Related to: 10