Work

Pluck-and-Probe Method for EBIRCH Isolation of Wordline Defects in 3D Replacement Gate NAND

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0090

Authors: Chandler Rich, Wayne Harlow, Becky Muñoz, Regino Sandoval, William Crow, Erik Jensen, J. Temo Davis, H M Ashfiqul Hamid

Institution: Micron (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685818

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