Work

Enhanced TEM Specimen Preparation for STEM-EBIC Analysis Using a Ga FIB system Followed by Post-FIB Ar Ion Beam Milling

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0191

Authors: C.S. Bonifacio, R. Li, M.L. Ray, P.E. Fischione, William Hubbard

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685855

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