Work

Failure Investigation of Copper-to-Copper Bonding in Advanced 3D Packaging—From Sample Preparation to Structural Characterization

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0200

Authors: Pawel Nowakowski, Richard Wei-Chih Li, Mary Ray, Paul Fischione

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685941

FWCI: 0.806

Cites:

Cited by: 1

Related to: 10