Work

X-Ray Nanotomography Enabling Submicron Resolution Failure Analysis for Advanced Packaging

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0169

Authors: Till Dreier, Daniel Nilsson, Julius Hållstedt, Jesper Wittborn

Institutions: Excillum (Sweden), Ericsson (Sweden)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403685974

FWCI: 1.562

Cites:

Cited by: 2

Related to: 10