Work

The Advanced Failure Analysis Methods Based on Dynamic Hot Electron Analyzer and IDD3P Measurements for HKMG Sub-nm DRAM

Year: 2024

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2024p0005

Authors: Sunah Lee, Jihoon Son, Jihoon Park, Bohyeon Jeon, Seokmin Yun, Chaesoo Kim, Hagyeong Kwon, Jayoung Lee, Sangjun Kim, Ilwoo Jung, SeGuen Park

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403686109

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