Work

EMI Mitigation for SiC Power Module With Chip-on-Ceramic Heatsink Packaging

Year: 2024

Type: article

Abstract: This letter proposes the use of a chip-on-ceramic heatsink packaging to reduce common-mode (CM) noise at the package level while improving thermal performance for SiC power modules. The packaging directly attaches the SiCmosfets to a metallized AlN ceramic heatsink, reducing CM capacitive coupling between the switching node and ground, thereby decreasing CM noise. A 400 to 200 V dc–dc buck converter is built to validate the effectiveness of the packaging in mitigating CM noise. The experimental results demonstrate a reduction in CM current, with a decrease of over 5 dB between 5 and 20 MHz frequency spectrum for the chip-on-ceramic heatsink power module compared to a conventional nonbaseplate module. Thermal test results indicate that the ceramic module exhibits better thermal performance than the conventional module, due to the reduced layers between the heatsink and the dice.

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2024.3486082

Authors: Zhaobo Zhang, Wenzhi Zhou, Xibo Yuan, Elaheh Arjmand, Lihong Xie

Institutions: University of Bristol, Coventry University, China University of Mining and Technology, Nanjing University of Aeronautics and Astronautics

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W4403721974

FWCI: 0.625

Cites: 17

Cited by: 6

Related to: 10