Thermal Failure Analysis of IGBT Based on the DeLaminations in the Backside Metal Films
Year: 2024
Type: conference-paper
Authors: Jinwen Wang, Wei Yin, Xin He, Jun Wang, Qingyuan Hua
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: State Grid Corporation of China
Award: G330855664
OpenAlex ID: W4403722852