Work

Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits

Year: 2024

Type: article

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems

DOI: 10.1109/tvlsi.2024.3478846

Authors: Changle Zhi, Gang Dong, Deguang Yang, Daihang Liu, Yinghao Feng, Yang Wang, Zhangming Zhu

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G1981401797, G2320218852, G783504360, G8921095769

OpenAlex ID: W4403758733

FWCI: 1.249

Cites: 35

Cited by: 12

Related to: 10