Work

Research on Hybrid Bonding Process of Micro-LED Preparation Based on Asymmetric Structure

Year: 2024

Type: article

Source: IEEE Electron Device Letters

DOI: 10.1109/led.2024.3486568

Authors: Luqiao Yin, Jianxin Li, Zhu Yang, Xiaoxiao Ji, Haojie Zhou, Jianhua Zhang

Institution: Shanghai University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G5637025066

OpenAlex ID: W4403758924

FWCI: 0.937

Cites: 18

Cited by: 9

Related to: 10