Work

Simplified Thermal Analysis and CFD Simulation in Design Process of Power PCB Fitted with SMD

Year: 2024

Type: conference-paper

DOI: 10.1109/pemc61721.2024.10726365

Authors: Martin Zavrel, Vladimir Kindl, Tristan Schönfelder, Bohumil Skala, Jaroslav Plesinger

Institution: University of West Bohemia in Pilsen

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: Technology Agency of the Czech Republic

OpenAlex ID: W4403759229

FWCI:

Cites: 4

Cited by:

Related to: 10