Work

Photopolymer Quality Measurement for SLA 3D Printing Using EIS

Year: 2024

Type: conference-paper

Source: New Trends in Signal Processing (NTSP)

DOI: 10.23919/ntsp61680.2024.10726288

Authors: Tomáš Kolenský, Kamil Jaššo

Institutions: University of Defence, Brno University of Technology

Language: English

Topic: Additive Manufacturing and 3D Printing Technologies

Subfield: Automotive Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403759956

FWCI:

Cites: 19

Cited by:

Related to: 10