Work

Simulation of RF de-sense in small form factor stacked die packages

Year: 2024

Type: conference-paper

Source: International Symposium on Electromagnetic Compatibility - EMC Europe (EMC Europe)

DOI: 10.1109/emceurope59828.2024.10722219

Authors: Jimmy A. Johansson, Graeme Osler, Gerardo Romo L

Institutions: Qualcomm (United Kingdom), Qualcomm (United States)

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403760479

FWCI:

Cites: 3

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Related to: 10