Work

Research on Au-In Flip-Chip Bonding Process of 2300 PPI Micro-LED Arrays

Year: 2024

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2024.3470769

Authors: Zhu Yang, Xiaoxiao Ji, Haojie Zhou, Jianxin Li, Xinyi Wang, Xiuzhen Lu, Luqiao Yin, Jianhua Zhang

Institution: Shanghai University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G3121791300

OpenAlex ID: W4403760484

FWCI: 0.937

Cites: 36

Cited by: 9

Related to: 10