Assessment of Different Scenarios on Input Impedance of a Thin Wire
Year: 2024
Type: conference-paper
Abstract: This paper assesses effects of distinct scenarios on the measurement of the input impedance of cables connecting two devices. The test setup comprises two vertical reference planes and a horizontal reference plane parallel to which a thin wire is placed. The wire is soldered to SMA connectors on both sides, and these connectors are attached to the vertical reference planes. The wire is also connected to a measurement device on one side and linked to DUTs on the other side. The DUTs represent three extreme cases: open, short, and load terminations. Other possible scenarios fall approximately between these extremes. For each DUT, a measurement is conducted, and a comparison is made. The results reveal that changes in the input impedance are not solely due to the wire; rather, terminations and the reference planes of the devices also significantly impact the behavior of the input impedance.
Authors: M. Khorramizadeh, L.A. Bronckers, A. Roc’h
Institution: Eindhoven University of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
Funder: Eurostars
OpenAlex ID: W4403760686