Year: 2024
Type: article
Abstract: Cooling of electronic components is of great importance currently. One of the most important methods of integrated circuit cooling is the use of microchannel heat sinks. The aim of this work is to analyze the cooling capacity of zigzag shaped microchannels. The heat exchange for four different microchannels was tested depending on the flow rate of the cooling liquid (water) and the temperature of the cooled element. The system of differential equations that describe fluid flow and heat transport is presented in the paper. The equations were solved using the finite volume method. The work showed that both the increase in the number of zigzag sections and the increase in the flow velocity cause an increase in the flow resistance. In contrast, an increase in the temperature of the cooled element causes a decrease in fluid viscosity, which results in a decrease in flow resistance. From the point of heat exchange, both the increase in the number of segments, the flow rate, and the temperature of the cooled element increase the cooling capacity of the microchannel. Research shows that zigzag shaped microchannels are excellent cooling elements, especially for geometrically small heat sources such as electronic components.
Source: Applied Sciences
DOI: 10.3390/app14219826
Authors: Maciej Staszak, Grzegorz Musielak
Institution: Poznań University of Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,728
Funder: Ministerstwo Edukacji i Nauki
OpenAlex ID: W4403835050