Year: 2024
Type: conference-paper
Abstract: Using the developed thermomechanical model, the temperature field and deformation movements of the layers of the LED matrix structure are determined. Calculations of the durability of the solder layer from the heat power dissipated by the LED matrix for three temperature modes of thermal cycling are carried out.
Authors: A.M. Hodakov, V.A. Sergeev, A.D. Shuravin, S.A. Zaitsev, Ulyanovsk Instrument Manufacturing Design Bureau, I.V. Frolov
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
OpenAlex ID: W4403890633