Work

Quality Control of Installation of Electronic Modules and Microassemblies on Temperature Fields and Transient Thermal Characteristics

Year: 2024

Type: conference-paper

Abstract: A brief overview of methods and tools for modeling and measuring the temperature fields of electronic modules and microassemblies and the transient thermal characteristics of their heat-loaded active elements for the purpose of diagnosing installation defects is presented.

DOI: 10.61527/appfe-2024.15-18

Author: V.A. Sergeev

Institutions: Russian Academy of Sciences, Kotelnikov Institute of Radioengineering and Electronics of the Russian Academy of Sciences, Ulyanovsk State Technical University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

OpenAlex ID: W4403890698

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