Extraction of Package Related Stress Effects in 180 nm SOI Technology
Year: 2024
Type: conference-paper
Source: CAS proceedings
Authors: Nikolay Bonev, Dirk M. Nuernbergk, Christian Lang
Institution: Melexis (Germany)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4403937248