Investigations on Thermal Performance of an Electronic Board Using Conduction-based Finite Element Method With a New Modeling Approach
Year: 2022
Type: article
Abstract: —Electronic systems are used in almost all areas of industry, with an increasing power consumption rate. This trend makes thermal management of the electronics compulsory, so that the related systems work properly during their applications. There are several methods to examine the thermal behavior of electronics. Conduction-based Finite Element Method (FEM) heat transfer analysis is one of them, with some outstanding advantages, such as accurate solutions with short solution times. Nevertheless, the fluid inside or around the system, usually air for electronic systems, is not included directly in the conduction-based FEM analysis model. This is an important deficiency in terms of solution accuracy. If this drawback is overcome, the conduction-based FEM will become a preferable analysis method, especially for transient problems under natural convection. In this study, a conduction-based FEM analysis model of an electronic board with two heat-dissipating components inside an enclosure under transient natural convection has been developed. The procedure of the analysis model involves correction of unknown input parameters. An experimental investigation was also performed, whose results were used as reference values for the correction process. These unknown parameters were determined in an iterative manner. The iteration was continued until the results of the analysis and the experiment matched. There was a large amount of discrepancy between the results of the initial analysis and the experiment. Whereas, the difference between the results of the final analysis and experiment was within acceptable limits. Using the final analysis model, some parametrical thermal investigations of the electronic board were performed.
Source: Isı Bilimi ve Tekniği Dergisi
DOI: 10.2139/ssrn.4146194
Institutions: Roketsan, University of Kyrenia, Gazi University
Language: English
Subfield: Computational Mechanics
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4403947389