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Polystyrene Novel Composites with Enhanced Thermal Stability and Improvised Conductivity

Year: 2024

Type: article

Abstract: Polymers having thermal stability and thermal conductivity are taken as the hot cake in the market these days. Manufacturing industries are focusing over the functional polymers with thermal management in aviation, electronics and other heat sink applications. In this research, general purpose polystyrene (GPPS-550P) is melt extruded with modified boron nitride powder. The fabricated composite samples showed an increase of 67.43% in thermal conduction. An increase of 56 multiple also achieved in thermal stability of the newly developed composite. This might be a tangible addition to the industrial word for developing functional polymers that offers stability and heat management applications synergistically.

Source: Materials science forum

DOI: 10.4028/p-xte9n3

Authors: Shafi Ur Rehman, Sana Javaid, Muhammad Shahid, Badar Rashid, Fawad Ahmad

Institutions: National University of Sciences and Technology, University of Wah, National University of Technology

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: hybrid

OpenAlex ID: W4403949080

FWCI: 0.192

Cites: 16

Cited by: 2

Related to: 10