Year: 2024
Type: article
Abstract: DOC spurs semiconductor packaging technologiesThe U.S. Department of Commerce's (DOC) National Institute of Standards and Technology has announced $1.6 billion in funding to enable the U.S. semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies.This investment comes as part of President Biden's overarching Investing in America agenda, which is increasing American competitiveness and boosting manufacturing in industries of the future, the department said."This ambitious funding opportunity is designed to fill key technology gaps in advanced packaging to ensure U.S. leadership in the global semiconductor ecosystem," said Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology Director Laurie E. Locascio in a statement."CHIPS for America is delivering on its mission to create a domestic packaging industry where advanced node chips manufactured in the U.S. and abroad can be packaged within the United States."Semiconductor packaging allows multiple components to be brought together as a single electronic device, said DOC, and advanced packaging brings those components together in novel ways that improves performance of chips while reducing cost and power consumption.According to the department, the program's five research and development areas will address key challenges and technology gaps in advanced packaging:• Equipment, Tools, Processes, and Process Integration • Power Delivery and Thermal Management • Connector Technology, Including Photonics and Radio Frequency (RF) • Chiplets Ecosystem • Co-design/Electronic Design Automation (EDA) For more information about the CHIPS NAPMP program, visit www.grants.govand search FON# 2025
Source: Federal Grants & Contracts
DOI: 10.1002/fgc.33998
Language: English
Subfield: Information Systems and Management
Field: Decision Sciences
Domain: Social Sciences
Open Access status: bronze
OpenAlex ID: W4404021657