Study on microstructure and reliability of SnAgCu and SnPb solder joints
Year: 2024
Type: conference-paper
DOI: 10.1117/12.3055021
Authors: Yue Huang, Jinxian Sun
Institution: China Shipbuilding Industry Corporation (China)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404034005