Work

Design and Experiment of a Dual-Frequency Ultrasonic Transducer for Aluminum Wedge Bonding

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3490672

Authors: Yuxiang Li, Zhili Long, Shuyuan Ye, Mian Yao, Xiangqing Li

Institution: Harbin Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Mitani Foundation for Research and Development, National Natural Science Foundation of China, Guangdong Academy of Sciences

Awards: G1867713091, G2727402839, G8148853522

OpenAlex ID: W4404057043

FWCI: 0.416

Cites: 19

Cited by: 4

Related to: 10