A Low-Voltage Area-Efficient TSV I/O With QEC Realizing Data Rate up to 15 Gb/s for TSV Interface
Year: 2024
Type: article
Authors: Taeryeong Kim, Ji-Young Kim, Jeonghyeok You, Hohyun Chae, Byoung Mo Moon, Kyomin Sohn, Seong-OoK Jung
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funders: IC Design Education Center, Samsung
OpenAlex ID: W4404057055