Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）
Year: 2024
Type: article
Abstract: This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueous solution can corrode the substrate, thereby decreasing the chemical resistance of the plated coating. A plating solution bath to which a combination of thiourea and hydroquinone had been added reduced the internal stress of the plating film, suppressed the rate of crack formation on the film surface, and reduced pinhole formation. Findings also revealed that the resultant film had higher resistance than conventional Ni-Sn films.
DOI: 10.4139/sfj.75.530
Authors: Takayuki IWAMOTO, Manato MIZUSHINA, Shiho KARIYA, Akimasa KAWAI, Mika FUKUNISHI, Futoshi MATSUMOTO
Institution: Kanagawa University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4404066933